Realize L/S：2/2μm Overlay：±1μm
Direct Imaging Exposure system for WLP / DE-2 W300
Direct Imaging Exposure system for PLP / DE-2 P600
Direct Imaging Exposure system for FO package of cutting edge semiconductor
and Organic package substrate (advanced BGA)
[ DE-2 ]
ADTEC Engineering Co., Ltd. (Headquarters: Tokyo, President: Osamu Mizuno) will launch a new direct imaging exposure system for WLP "DE-2 W300" in July, 2021 to customers who manufacture cutting-edge semiconductor FO packages and organic package substrates (advanced BGA); ADTEC will later release a direct imaging exposure system for PLP "DE-2 P600" in December, 2021.
This latest direct imaging exposure system was realized by adopting three advancements: 1) a high-precision stage, 2) achieving an overlay of ± 1 μm and L/S: 2/2 μm, and 3) using the latest optical system. These improvements will increase the precision and resolution capabilities for the production of cutting-edge semiconductor FO packages and organic package substrates. Furthermore, the system will be able to support multi-chip FO by integrating with Adaptive PatterningTM of Deca Technologies *1 of the United States, which announced its collaboration with ADTEC last year.
Please refer to the below URL for the detail information about the collaboration with*1: Deca Technologies.
ADTEC Engineering Co., Ltd.
WLP Exposure System Division, Sales Department