A new patent-pending technology enables automatic stripping of difficult-to-peel films such as dry film solder resist, ABF, and dry film resist. For the first time in the industry, no knurling is performed during the peeling process, enabling stable peeling with minimal damage to the substrate.
KNURLINGLESS PEELING
Stable peeling is possible by the patent-pending knurling-less peeling automatic creation mechanism.
・Reduced damage to substrates
・Reduced particles (high cleanliness)
Applicable to various types of workpieces
Highly adherent films (dry film resist, ABF, dry film solder resist, etc.) that were difficult to peel automatically with conventional auto peelers can be peeled off.
It can also be used for various types of workpieces such as ultra-thin films for semiconductors and electronic components, and protective films for acrylics and glass.
【Compatible with various types of difficult-to-peel films.】
Interlayer dielectric material (ABF)
Dry film solder resist (DFSR)
Polyimide film (PID)
Other strong adhesion films
Other high-strength adhesion films
Organic substrates (thin, laminated, thick, etc.)
Glass substrates
Silicon wafers
Other special substrates
Various options
ABF film breakage reduction specification
Strong adhesion film specification
EFEM connection
Clamp type hand specification
Film remainder detection mechanism
High-level communication (GEM/GEM300, etc.)
Other special specifications and custom products are also available.
Sample substrate peeling test
We can also perform peeling tests on your sample substrates. Please contact our sales r