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Direct Imaging Exposure system for FO package of cutting edge semiconductor and Organic package substrate(advanced BGA)
Notice of "Expansion of Production Capacity" at the Nagaoka Plant
Notice of office and factory closure during new year holidays
ADTEC Partners with Deca to Enhance Adaptive Patterning™ for 2µm Chiplet Scaling
Notification of Headquarters Relocation
ADTEC will be closed from August 8th to 16th 2020
We will release the industry's fastest DI for HDI
Notice of our operation status (related to "COVID-19")
Notice of Implementation of Teleworking
Second hand machine information has been updated