Cover Film Peeling Equipment for Printed Circuit Boards [New]
ACPM650
ACPM650 automatically peels off mylar cover film that had been applied on dry-film photoresist surface of printed circuit boards before development.
ACPM650 peels off film on both sides of a board put in from the front-end process equipment and then sends the board to the developer.
Features
Clean peel-off process
The peel-off process uses adhesive rollers, avoiding the use of air-blow, thus drastically reducing unwanted scattering of dry-film chips.
A down-flow system using HEPA-filtered clean air can be applied. (optional)
No additional setup required for thin boards/thick boards (simplified)
The equipment does not need different setups for different thicknesses or sizes of boards.
Boards that failed in the peeling process are piled up in a defect stocker, which can store up to four boards.
Installation of ultrasonic sensors enables the equipment to detect whether or not film is completely peeled off.
The equipment can process very thin boards.
Board thickness capable of processing 0.025～3.2mm (board thickness)
Adapting a newly developed knurling mechanism with horizontal movement has facilitated the peeling process.
The end of a board at the input is mechanically chucked to prevent thin boards from being rolled into the adhesive roller, providing a solution to the perceived issue.
The conveyer mechanism has a smaller roller pitch, enabling stable transportation.
For inquiries regarding product demonstrations, product specification tours, or evaluation testing, please contact below: E-mail sales@adtec-eng.co.jp TEL +81-3-3433-4466(main) Weekdays 9:00 - 17:30 FAX +81-3-3433-4330
