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| Step & Repeat Enlarging Projection Exposure Equipment |
| APEX4000P/APEX4000S |
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| APEX4000P/APEX4000S are equipped with the projection optical method newly developed by ADTEC Engineering exclusively for use in printed circuit board manufacturing. |
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| Features |
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| 2X projection magnification |
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Full plate exposure is possible for an area as large as 250X200mm(f320mm) with a mask as small as 6 inches square (152X152mm).This equipment enables the user to minimize mask cost as well as reduce mask storage space. |
| High-resolution projection optical method |
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This method achieves a high resolution of 10µm across a board (when using 10µm-thick dry film) by taking lens processing accuracy and lens mounting process dispersion into consideration at the design stage in order to minimize distortion. |
| High productivity |
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This equipment achieves high throughput with processing exposure of a substrate of 510X610mm size with six exposure shots and a substrate of 510X410mm size with four exposure shots. |
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| Sufficient focal depth |
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Focal depth is ±100µm for the APEX4000P, and ±75µm for the APEX4000S, which enables the equipment to process substrates with irregularity such as unevenness, warping, or waviness. |
| Independent vertical and horizontal variable exposure-magnification feature (X-Y independent variable magnification feature) |
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The equipment can automatically adjust the projection magnification independently in X and Y directions, providing correction with sufficient accuracy for expansion or contraction of substrates, a characteristic issue of printed circuit boards. |
| TTL (Through The Lens) alignment system |
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The system achieves independent X-Y variable magnification and alignment with high accuracy by using separate CCDs to simultaneously detect the projected images of alignment marks of the mask and the marks on the substrate.
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| Reticle changer |
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A reticle (mask) changer provides automatic changing of reticles. |
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