| High-precision alignment |
- An alignment operation is performed on the exposure stage, and then confirmed again right before exposure to ensure reliable, high alignment precision. Use of a shape search method for image processing enables the equipment to improve mark recognition capability.
- In addition to the conventional mark-registration method, MMD method (based on the minimum distance between marks) is also available for alignment.
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| Adaptability to thin substrate (one-piece table structure) |
The exposure stage uses a one-piece table with no joints to achieve stable transportation, adhesion, and exposure for thin substrates such as flexible boards. |
| Minimizing dust generation |
Use of stainless steel covers, an ionizer, and HEPA-filtered clean air blown onto the top surface of the mask holder enables the system to minimize defects caused by dust. |
| High-speed substrate transportation mechanism |
Substrate transportation is performed by arms equipped with vacuum adhesion. The arm driving mechanism achieves high-speed, high-precision, and clean transportation. |
| Stickiness prevention |
HEPA filtered, cool air is blown to the photomask holder minimizing temperature increase of the photomask.The exposure stage is also water cooled preventing stickiness of solder resist surface. |
| Remote support services |
Realtime support can be optionally provided with remote monitoring of touch screen and image processing screen by having an Internet connection where ADTEC Engineering's exposure systems are installed at the customer's site to connect to ADTEC Engineering's Support Center. |
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