| High-precision alignment |
- An alignment operation is performed on the exposure stage, and then confirmed again right before exposure to ensure reliable, high alignment precision. Use of a shape search method for image processing enables the equipment to improve mark recognition capability.
- In addition to the conventional mark-registration method, MMD method (based on the minimum distance between marks) is also available for alignment.
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| Adaptability to thin substrate (one-piece table structure) |
The exposure stage uses a one-piece table with no joints to achieve stable transportation, adhesion, and exposure for thin substrates such as flexible boards. |
| Minimizing dust generation |
Use of stainless steel covers, an ionizer, and HEPA-filtered clean air blown onto the top surface of the mask holder enables the system to minimize defects caused by dust. |
| High-speed substrate transportation mechanism |
Substrate transportation is performed by arms equipped with vacuum adhesion. The arm driving mechanism achieves high-speed, high-precision, and clean transportation. |
| Measures against sticking |
Humidity-controlled clean air is directly blown onto the mask holder in the exposure room to prevent temperature rise in glass masks. The system also controls the temperature of the exposure stage to minimize substrate sticking. |
| Remote support services |
The exposure equipment is connected to our support center via the internet. By monitoring the work process with on-screen images, and with touch-panel screens that bring about immediate response, real time service is available. |
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